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Publications by T.G. Snodgrass
A Statistical Analysis of Copper Bottom Coverage of High-Aspect-Ratio Features Using Ionized Physical Vapor Deposition
IEEE Transactions on Semiconductor Manufacturing
Electronic Engineering
Industrial
Condensed Matter Physics
Manufacturing Engineering
Optical
Electrical
Magnetic Materials
Electronic
Related publications
Study on the Mechanism and Modeling for Super-Filling of High-Aspect-Ratio Features With Copper by Catalyst Enhanced Chemical Vapor Deposition Coupled With Plasma Treatment
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
Defect at the Bottom of a High Aspect-Ratio Contact Hole Induced by Proton Channeling
Materia Japan
Fabrication of High-Aspect-Ratio Microstructures Using Excimer Laser
Optics and Lasers in Engineering
Electronic Engineering
Mechanical Engineering
Optics
Molecular Physics,
Optical
Electrical
Atomic
Magnetic Materials
Electronic
Fabrication of High-Aspect-Ratio Metallic Nanostructures Using Nanoskiving
High Temperature Dielectric Properties of (BxNyOz) Thin Films Deposited Using Ion Source Assisted Physical Vapor Deposition
Journal of Advanced Dielectrics
Electronic Engineering
Condensed Matter Physics
Optical
Electrical
Magnetic Materials
Composites
Electronic
Ceramics
Analysis of Vapor Deposition Processes
Metallurgical and Materials Transactions B
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
High-Aspect-Ratio Copper via Filling Used for Three-Dimensional Chip Stacking
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Organometallic Chemical Vapor Deposition of Copper Oxide Thin Films
Excimer-Laser-Induced Chemical Vapor Deposition of Copper Films From Copper Trifluoroacetylacetonate
Le Journal de Physique IV
