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Publications by Tadashi TAKAI

Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

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Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

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Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments

English

Technical Trend of Chip Components.

English

Millimeter-Wave Flip-Chip IC Module.

English

DEVELOPMENT OF FLIP CHIP TECHNIQUES FOR CONSTRUCTING MONOLITHIC MULTI-CHIP ARRAYS. Final Report.

English

Ringo – An R/Bioconductor Package for Analyzing ChIP-chip Readouts

BMC Bioinformatics

Applied Mathematics

Computer Science Applications

Structural Biology

Molecular Biology

English

Structural Design of a Highly Reliable Fan-Out-Type Chip Scale Package.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Investigation of Flip-Chip Bonding for MEMS Applications

Journal of Electronic Packaging, Transactions of the ASME

Mechanics of Materials

Electronic Engineering

Computer Science Applications

Magnetic Materials

English

Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages

Journal of Light and Visual Environment

Electronic Engineering

English