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Publications by Tadatomo Suga
Strain Effect in Highly-Doped N-Type 3c-SiC-On-Glass Substrate for Mechanical Sensors and Mobility Enhancement (Phys. Status Solidi a 24∕2018)
Physica Status Solidi (A) Applications and Materials Science
Surfaces
Electronic Engineering
Condensed Matter Physics
Materials Chemistry
Optical
Electrical
Magnetic Materials
Films
Coatings
Electronic
Interfaces
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Surface Contamination on Solid-State Bondability of Sn-Ag-Cu Bumps in Ambient Air
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Fracture Mechanical Approach to the Growth of Interfacial Defects in Al/Sapphire Joint Fabricated by SAB: Tearing-Off Test and Analysis by Finite Element Method
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
TEM Observation of the Al and Cu Interfaces Bonded at Room Temperature by Means of the Surface Activation Method
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs With Au-Au Surface Activation
IEEJ Transactions on Sensors and Micromachines
Electronic Engineering
Electrical
Mechanical Engineering
Evaluation of Alignment Accuracy for Wafer Bonding Using Moire Technique
