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Publications by Takaaki ANADA
Electrochemical Mechanism on Improvement of Wettability by Addition of Lead to Sn-3.4Ag Lead-Free Solder.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Lead-Free Solder Paste and VOC-Free Solder Paste.
Journal of SHM
Thermodynamic Properties of Al in Ternary Lead-Free Solder Al-Sn-Zn Alloys
Materials Science-Poland
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Fatigue Characteristics of Lead-Free Solder Alloys.
Materia Japan
Recent Situation of Lead-Free Solder Technology
Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds
Microscopy and Microanalysis
Instrumentation
Evaluation of Non-Proportional Multiaxial Fatigue Strength of Lead-Free Solder With Elements Addition
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes
Journal of Applied Physics
Astronomy
Physics
