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Publications by Takatoshi Hasegawa

Ultra-Low-Modulus Positive-Type Photosensitive Polyimides (4). Improvement of Adhesion Strength With Copper Foil

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Related publications

Positive-Type Photosensitive Polyimide With Low Modulus Based on Soluble Block Copoly(imide-Siloxane)

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Improvement of EpoxyResin/Copper Foil Adhesion by Introduction of Sulfur-Containing Polymers

Journal of The Adhesion Society of Japan

English

Photochemical Behavior of Nifedipine Derivatives and Application to Photosensitive Polyimides.

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Synthesis of New Photosensitive Polyimides Containing Pendant Propargyl Ester Groups

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Analysis of Tarnished Copper Foil

Journal of The Surface Finishing Society of Japan

English

Thermally Stable Photopolymers for Electronics. Molecular Design and Performance of Photosensitive Polyimides.

English

Ultra-Low Radioactivity Kapton and Copper-Kapton Laminates

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

High Energy Physics

Instrumentation

English

High Tenacity and High Modulus Fibers From Wholly Aromatic Polyimides

Sen'i Gakkaishi

Materials Science

Manufacturing Engineering

Chemical Engineering

English

Influence of Substrate Modulus on Gecko Adhesion

Scientific Reports

Multidisciplinary

English