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Publications by Takeshi Terasaki

Warpage Prediction of Ball Grid Array Package With the Homogenization Method

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2013English

The Current Situation and Challenges of Strength Reliability Evaluation for Solder Joints

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2012English

Development of Diagnosis AT System Using Knowledge Acquisition Technology

IEEJ Transactions on Electronics, Information and Systems
Electronic EngineeringElectrical
1998English

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