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Publications by Teng-Hsien Lai

Design and Fabrication of Electroplating Nickel Micromachined Probe With Out-Of-Plane Predeformation

Journal of Physics: Conference Series

English

Related publications

Design and Fabrication of Condenser Microphone Using Wafer Transfer and Micro-Electroplating Technique

English

Fabrication of Optical Wave-Guides in Silica-On-Silicon by Nickel Electroplating and Conventional Reactive Ion Etching

Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

English

Design and Fabrication of a Novel Resonant Surface Sensitive to Out-Of-Plane Forces for the Indentation and Injection of Living Cells

English

A Novel Fabrication Process for Out-Of-Plane Microneedle Sheets of Biocompatible Polymer

Journal of Micromechanics and Microengineering

Mechanics of Materials

Electronic Engineering

Mechanical Engineering

Magnetic Materials

English

Design and Fabrication of Electrostatically Actuated Serpentine-Hinged Nickel-Phosphorous Micromirror Devices

English

Optimal and Robust Design Method for Two-Chip Out-Of-Plane Microaccelerometers

Instrumentation

Information Systems

Electronic Engineering

Analytical Chemistry

Molecular Physics,

English

Fabrication of Thin Palladium Membrane by Electroplating Coexisting With Supercritical Carbon Dioxide

English

Fabrication of High Current and Low Profile Micromachined Inductor With Laminated Ni/Fe Core

IEEE Transactions on Components and Packaging Technologies

English

Micromachined Silicon Cantilevers and Tips for Scanning Probe Microscopy

Microelectronic Engineering

Electronic Engineering

Condensed Matter Physics

Molecular Physics,

Magnetic Materials

English