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Publications by Tetsuya KUGIMIYA
Thermal Fatigue Life Evaluation of Substrate With Cu Through-Hole Considering the Mechanical Properties of Cu Thin Film and Glass Fiber Cloths Structure
Transactions of the JSME (in Japanese)
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Interface Structure of Cu Wire Bonding on Cu Substrate With Sn Plating
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Erratum To: Thermal Stability, Mechanical Properties and Corrosion Behavior of a Mg–Cu–Ag–Gd Metallic Glass With Nb Addition
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MR Properties and Thermal Stabilities of Cu/Co/Cu/NiFe Multilayers.
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MATEC Web of Conferences
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