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Publications by Tomas Janacek
A Study of Collimated Sputtering for VLSI Metallization.
Related publications
High-Purity Refractory Metals for Thin Film Metallization of VLSI
Tungsten Selective CVD and Its Applications to VLSI Metallization.
Bulletin of the Japan Institute of Metals
Gasless Sputtering: Opportunities for Ultraclean Metallization, Coatings in Space, and Propulsion
Applied Physics Letters
Astronomy
Physics
A Comparative Study of Synchronous Clocking Schemes for VLSI Based Systems
VLSI Design
Electronic Engineering
Computer Graphics
Hardware
Electrical
Architecture
Computer-Aided Design
Topological Solutions for Collimated MHD Flows
Symposium - International Astronomical Union
Platinum Metallization for MEMS Application
Biomatter
Medicine
Biomedical Engineering
Biomaterials
Collimated Outflows in Planetary Nebulae
Symposium - International Astronomical Union
Comparative Study of Cu Diffusion in Ru and Ru-C Films for Cu Metallization
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
System Characteristics of SPECT With a Slat Collimated Strip Detector
Physics in Medicine and Biology
Radiological
Radiology
Nuclear Medicine
Ultrasound Technology
Imaging
