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Publications by Tomohiro Okumura
Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Atmospheric Pressure Plasma Processing for Surface Finishing. The Characteristics of Atmospheric Pressure Non-Equilibrium Plasma Processing.
Journal of the Surface Finishing Society of Japan
The Ontology Based FMEA of Lead Free Soldering Process
Properties of Plasma Sterilizer Using Non-Thermal Atmospheric-Pressure Biocompatible Plasma
AIP Advances
Nanotechnology
Astronomy
Physics
Nanoscience
In-Package Atmospheric Pressure Cold Plasma Treatment of Strawberries
Journal of Food Engineering
Food Science
Non-Thermal Atmospheric Plasma for Endodontic Treatment
Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)
Powder Metallurgy Progress
Mechanics of Materials
Alloys
Metals
Editorial: Atmospheric Pressure Plasma Polymerization
The Open Plasma Physics Journal
The Antibacterial Effect of Non-Thermal Atmospheric Pressure Plasma Treatment of Titanium Surfaces According to the Bacterial Wall Structure
Scientific Reports
Multidisciplinary
Kinetic Modelling of Atmospheric Pressure Nitrogen Plasma
American Journal of Modern Physics
