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Publications by Tomokazu Niimi
Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
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Condensed Matter Physics
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Magnetic Susceptibility of HCP Ζ-Phase Alloys in Ag–In, Ag–Sn, Au–In, and Au–Sn Systems
Transactions of the Japan Institute of Metals
Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders
Materials Transactions
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Microstructure and Mechanical Properties of Cu–40%Zn–0.5%Cr Alloy by Powder Metallurgy
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Microstructures and Mechanical Properties of Highly Electrically Conductive Cu–0.5, Cu–1 and Cu–2 At%Zr Alloy Wires
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The C Curves Determined by Isothermal Treatments in the Age-Hardening Cu–Cr, Cu–Be and Cu–Co2Si Alloys
Transactions of the Japan Institute of Metals
Formation of Amorphous Cu–Ag–Ce Alloys by Rapid Solidification and Their Thermal and Mechanical Properties
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Brazing With Cu–Ag Eutectic Alloy for Metal-To-Ceramic Seals
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Microstructure and Corrosion Resistance of Ti–Zr–Cu–Pd–Sn Glassy and Nanocrystalline Alloys
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