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Publications by Tomotake Niizeki
Laser Sintering Technology for Printed Electronics: Minute Wiring and Functional Coating With Ag-Nanoparticle Paste
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.
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Microwave Sintering of Ag-Nanoparticle Thin Films on a Polyimide Substrate
AIP Advances
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Synthesis With Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic Packaging
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Pulsed Laser Annealing of Ag-Paste on N-Doped Emitter
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Automatic Inspection System for Printed Wiring Board Patterns.
The Journal of the Institute of Television Engineers of Japan
Filament Formation on Printed Wiring Boards