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Publications by Tomoyuki Kosugi
Connection Reliability of WL-CSP by the Flip Chip Implementation
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
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Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
Journal of Japan Institute of Electronics Packaging
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Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.
Journal of Japan Institute of Electronics Packaging
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Millimeter-Wave Flip-Chip IC Module.
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Investigation of Flip-Chip Bonding for MEMS Applications
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
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Magnetic Materials
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DEVELOPMENT OF FLIP CHIP TECHNIQUES FOR CONSTRUCTING MONOLITHIC MULTI-CHIP ARRAYS. Final Report.
Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding
Transactions of The Japan Institute of Electronics Packaging
The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints
Solder Paste Reflow Modeling for Flip Chip Assembly
Stresses From Flip-Chip Assembly and Underfill; Measurements With the ATC4.1 Assembly Test Chip and Analysis by Finite Element Method
