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Publications by Tong An
Mechanical Properties of Silicon in Subsurface Damage Layer From Nano-Grinding Studied by Atomistic Simulation
AIP Advances
Nanotechnology
Astronomy
Physics
Nanoscience
Related publications
Magnetic Properties of Sm2Fe17Nx Powders Prepared by Mechanical Grinding
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Atomistic Simulation of Damage Production by Atomic and Molecular Ion Irradiation in GaN
Journal of Applied Physics
Astronomy
Physics
Influence of Mechanical Grinding on Lithium Insertion and Extraction Properties of Iron Silicide/Silicon Composites
Journal of Power Sources
Electronic Engineering
Sustainability
Energy Engineering
Renewable Energy
Theoretical Chemistry
Electrical
Power Technology
the Environment
Physical
Modeling and Simulation of Mechanical Properties of Nano Particle Modified Polyamide 6
Journal of Materials Science and Chemical Engineering
Evaluation of Subsurface Damage in Silicon Wafer Based on Deflection Analysis
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Mechanical Deformation Mechanisms and Properties of Prion Fibrils Probed by Atomistic Simulations
Nanoscale Research Letters
Materials Science
Nanotechnology
Condensed Matter Physics
Nanoscience
Photoelectrocatalytic Activity of ZnO Coated Nano-Porous Silicon by Atomic Layer Deposition
RSC Advances
Chemistry
Chemical Engineering
Mechanical Properties of Silicon Nanowires
Nanoscale Research Letters
Materials Science
Nanotechnology
Condensed Matter Physics
Nanoscience
Low-Damage Direct Patterning of Silicon Oxide Mask by Mechanical Processing
Nanoscale Research Letters
Materials Science
Nanotechnology
Condensed Matter Physics
Nanoscience
