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Publications by Toshikazu Ookubo
Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating With Those Produced by Autocatalytic Electroless Gold Plating
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
High Speed Selective Gold Plating of Lead Frames
Gold Bulletin
Materials Science
Inorganic Chemistry
The Properties of Gold Deposits Produced by DC, Pulse and Asymmetric AC Plating
Gold Bulletin
Materials Science
Inorganic Chemistry
Electroless Plating
Journal of the Japan Society of Colour Material
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
The First Gold Plating in America
Gold Bulletin
Materials Science
Inorganic Chemistry
Electroless Plating of Paper
Sen'i Gakkaishi
Materials Science
Industrial
Polymers
Manufacturing Engineering
Plastics
Chemical Engineering
Electroless Plating of Silver.
Journal of the Metal Finishing Society of Japan
Formation of the Porous Film by Electroless Copper Plating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Electroless Plating on Titanium.
Jitsumu Hyomen Gijutsu
