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Publications by Tung‐Han Chuang

Low Temperature Direct Electroless Nickel Plating on Silicon Wafer

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an

English

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Direct Circuit Formation Method on Aluminum Substrate by Electroless Nickel Plating.

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Development of Low-Temperature Type Electroless Nickel Plating Bath Containing Hypophosphite as a Reducing Agent.

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Direct Electroless Copper Plating on Alumina Ceramics.

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