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Publications by V. Zieren

A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process—Part I: The Conflict Electrical Versus Thermal Isolation

IEEE Transactions on Electron Devices

Electronic Engineering

Magnetic Materials

English

Related publications

A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process—Part II: A Novel Analysis of Thermal Breakdown

IEEE Transactions on Electron Devices

Electronic Engineering

Magnetic Materials

English

Reduction of Thermal Conductivity in Wafer-Bonded Silicon

Applied Physics Letters

English

Etching Technologies of Silicon Wafer Using Dry Process

Journal of The Surface Finishing Society of Japan

English

Back-Contacted Silicon Heterojunction Solar Cells: Optical-Loss Analysis and Mitigation

IEEE Journal of Photovoltaics

Electronic Engineering

Condensed Matter Physics

Magnetic Materials

English

Methanol Steam Reformer on a Silicon Wafer

Journal of Microelectromechanical Systems

Electronic Engineering

Mechanical Engineering

English

Thermal Deformation of Glass Backplane During Flash Lamp Crystallization Process of Amorphous Silicon

Transactions of the Korean Society of Mechanical Engineers, B

Mechanical Engineering

English

Thermal Damage Characterization of Silicon Wafer Subjected to CW Laser Beam

Transactions of the Korean Society of Mechanical Engineers, A

Mechanical Engineering

English

Dicing Process for Thin Silicon Wafer by Using Femtosecond-Laser

Journal of the Japan Society for Precision Engineering, Contributed Papers

English

Erratum: ‘‘Elimination of Slips on Silicon Wafer Edge in Rapid Thermal Process by Using a Ring Oxide’’ [J. Appl. Phys. 67, 7583 (1990)]

Journal of Applied Physics

English