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Publications by W. Steinhögl
Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Influence of Grain Size Distributions on the Resistivity of 80 Nm Wide Cu Interconnects
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Structural Response of Nano-Scale Damascene Copper Lines to Annealing
Electrochemistry
Electrochemistry
Effects of Multi-Layer Graphene Capping on Cu Interconnects
Nanotechnology
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Materials Science
Nanoscience
Electrical
Bioengineering
Nanotechnology
Chemistry
Resistivity of Cu-Ni/Cu/Cu-Ni Multilayer Materials
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Stress Migration Phenomena of Cu Interconnects
Resistivity of Cu/Ni Multilayer Materials
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Classical Size Effect in Oxide-Encapsulated Cu Thin Films: Impact of Grain Boundaries Versus Surfaces on Resistivity
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Surfaces
Films
Interfaces
Condensed Matter Physics
Coatings
Anomalous Resistivity Change of Ag–Al Alloys on Annealing in Oxygen
Transactions of the Japan Institute of Metals
