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Publications by Walid M. Daoush
Microstructure and Properties of BN/Ni-Cu Composites Fabricated by Powder Technology
Journal of Experimental Nanoscience
Materials Science
Nanotechnology
Nanoscience
Biomedical Engineering
Bioengineering
Adsorption of Congo Red (Acid Red 28) Azodye on Biosynthesized Copper Oxide Nanoparticles
Asian Journal of Chemistry
Chemistry
Related publications
Physico-Mechanical and Tribological Properties of Fe-Cu-Ni-Sn and Fe-Cu-Ni-Sn-Vn Nanocomposites Obtained by Powder Metallurgy Methods
Tribology in Industry
Mechanics of Materials
Surfaces
Mechanical Engineering
Interfaces
Films
Coatings
Microstructure and Mechanical Properties of Hetero-Designed Ti-25Nb-25Zr Alloy Fabricated by Powder Metallurgy Route
Letters on Materials
Materials Science
MICROSTRUCTURE, MECHANICAL PROPERTIES AND FRICTION/WEAR BEHAVIOR OF HOT-PRESSED Si₃N₄/ BN CERAMIC COMPOSITES
Ceramics - Silikaty
Analytical Chemistry
Theoretical Chemistry
Materials Chemistry
Chemical Engineering
Composites
Ceramics
Physical
Characterization of BN Powder and BN Films by EPMA
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Microstructure, Properties, and Titanium Cutting Performance of AlTiN–Cu and AlTiN–Ni Coatings
Coatings
Surfaces
Films
Coatings
Materials Chemistry
Interfaces
Microstructure and Mechanical Properties of Cu–40%Zn–0.5%Cr Alloy by Powder Metallurgy
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Ni/Si Mass Ratio and Thermomechanical Treatment on the Microstructure and Properties of Cu-Ni-Si Alloys
Materials
Materials Science
Condensed Matter Physics
Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
The Study of Properties of WC-Based and W-Based Composites Fabricated by Infiltration With Liquid Cu-Mn Binder
Asian Journal of Scientific Research
Multidisciplinary
