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Publications by Wen-Yeong Huang
Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 Mass% Ag-1.5 Mass% Sb-xCu Solder Joints
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints
Transactions of The Japan Institute of Electronics Packaging
Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints During Thermal Cycling
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of 0.05 Wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint During the Thermal Aging Process
Applied Sciences (Switzerland)
Instrumentation
Materials Science
Fluid Flow
Engineering
Computer Science Applications
Process Chemistry
Transfer Processes
Technology
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds
Microscopy and Microanalysis
Instrumentation
Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Bi or Sb Addition on High Temperature Deformation Behavior in Sn-Cu-Ni Solder Alloys
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
