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Publications by William H. Greenwood
Thermal Vacuum Tests of a Five Watt Pseudo Chip in a SEM-X Electronic Module Clamped in a Satellite Box
AIP Conference Proceedings
Astronomy
Physics
Related publications
Use of Cold Radiometers in Several Thermal/Vacuum Tests
Unapproved Tests on a Chip
Nature
Multidisciplinary
Thermal Degradation of Tetrafluoroethylene and Hydrofluoroethylene Polymers in a Vacuum
Journal of Research of the National Bureau of Standards
Designing a Toy Box Organizer: A PictureSTEM Curriculum Module (Curriculum Exchange)
The Module of Pseudo-Rational Relations of a Quotient Divisible Group
St. Petersburg Mathematical Journal
Applied Mathematics
Number Theory
Analysis
Algebra
Examination of a Junction-Box Adhesion Test for Use in Photovoltaic Module Qualification
CHIP Is a U-Box-Dependent E3 Ubiquitin Ligase
Journal of Biological Chemistry
Biochemistry
Cell Biology
Molecular Biology
Use of Collapsible Box Trainer as a Module for Resident Education
Journal of the Society of Laparoendoscopic Surgeons
Surgery
CMOS Image Sensors: Electronic Camera-On-A-Chip
IEEE Transactions on Electron Devices
Electronic Engineering
Optical
Electrical
Magnetic Materials
Electronic
