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Publications by Wolfgang Friz

Investigation of a Proactive Glass Filler Removal in IC Substrate Build Up Films and Its Effect on Topography and Copper Adhesion Reliability

International Symposium on Microelectronics

English

Related publications

Substrate-Induced Strain and Its Effect in CrO2 Thin Films

Journal of Applied Physics

English

Probing the Chemistry of Adhesion Between a 316L Substrate and Spin-On-Glass Coating

Materials Science

Condensed Matter Physics

Electrochemistry

English

Adhesion Assessment of Copper Thin Films

Materials Research Society Symposium - Proceedings

Mechanics of Materials

Materials Science

Condensed Matter Physics

Mechanical Engineering

English

Influence of Substrate Topography on the Nucleation of Diamond Thin Films

Applied Physics Letters

English

Bismuth Substituted Garnet Films Sputtered on Chromium Coated Glass Substrate

Journal of the Magnetics Society of Japan

English

Misfit Twin Crystals in Deposited Chromium Films on (001) Copper Substrate

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Materials Chemistry

Condensed Matter Physics

English

Annealing Effect on a Boundary Layer Between Oxide Superconducting Films and a Substrate

IEEJ Transactions on Fundamentals and Materials

Electronic Engineering

English

Effect of Heat Build-Up on Carbon Emissions in Chimato Compost Piles

African Journal of Environmental Science and Technology

English

Present and Future of Build-Up PWB's-Their Possibility and Limitation. Microvia Technology Trends: Product Boards and IC Packages.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English