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Publications by X.Y. Cai

A Shell Model for the Filament Structure of Bi-2223 Conductors

IEEE Transactions on Applied Superconductivity
Electronic EngineeringCondensed Matter PhysicsOpticalElectricalMagnetic MaterialsElectronic
2005English

Transport Properties Across High-Angle Bicrystals of Melt-Textured YBa/sub 2/Cu/Sub 3/O/Sub 6+x/

IEEE Transactions on Applied Superconductivity
Electronic EngineeringCondensed Matter PhysicsOpticalElectricalMagnetic MaterialsElectronic
1993English

Related publications

Phase Stability and Grain Growth in an Ag/Bi-2223 Composite Conductor Prepared Using Fine-Grained Bi-2223 as a Precursor

IEEE Transactions on Applied Superconductivity
Electronic EngineeringCondensed Matter PhysicsOpticalElectricalMagnetic MaterialsElectronic
1999English

Intragranular and Intergranular Behaviour of Multifilamentary Bi-2223/Ag Tapes

Physica C: Superconductivity and its Applications
Electronic EngineeringCondensed Matter PhysicsEnergy EngineeringOpticalElectricalMagnetic MaterialsPower TechnologyElectronic
2002English

Precursor Size Effects on Kinetics Parameters of Bi-2223 Growth

The Open Superconductors Journal
2009English

Higher Critical Current Density Achieved in Bi-2223 High-Tc Superconductors

Journal of Radiation Research and Applied Sciences
2016English

Investigation of the Level Structure of 90Nb Nucleus Using the Shell Model

Nukleonika
InstrumentationRiskWaste ManagementDisposalNuclear EnergyHigh Energy PhysicsEngineeringReliabilitySafetyNuclearQualityCondensed Matter Physics
2019English

Extracting the Evaluations of Stereotypes: Bi-Factor Model of the Stereotype Content Structure

Frontiers in Psychology
Psychology
2017English

Synthetic Conditions of High-Tc (2223) Phase of Bi-Pb-Sr-Ca-Cu-O Superconductor.

NIPPON KAGAKU KAISHI
1990English

Dependence of Reactive Metal Layer on Resistive Switching in a Bi-Layer Structure Ta/HfOx Filament Type Resistive Random Access Memory

Applied Physics Letters
AstronomyPhysics
2014English

AC Transport Losses Calculation in a Bi-2223 Current Lead Using Thermal Coupling With an Analytical Formula

IEEE Transactions on Applied Superconductivity
Electronic EngineeringCondensed Matter PhysicsOpticalElectricalMagnetic MaterialsElectronic
2005English

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