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Publications by Yaroslav Kozlov
Investigation of Adsorption Behavior of Smoothing Additives in Copper Plating Electrolytes
EasternEuropean Journal of Enterprise Technologies
Control
Electronic Engineering
Industrial
Mechanical Engineering
Energy Engineering
Applied Mathematics
Systems Engineering
Manufacturing Engineering
Computer Science Applications
Electrical
Innovation
Management of Technology
Power Technology
Related publications
Investigation of the Influence of Plating Additives on Lattice Defects in Electrolytic Copper Using Positron Annihilation Technique
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Plating Time Dependence of Filling Ability With Additives by Copper Electroplating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
A Monitoring Method of Additives in a Copper Sulfate Plating Solution Using a Near-Field Optical Sensor
Journal of The Surface Finishing Society of Japan
Adsorption–Desorption Behavior of Copper at Contaminated Levels in Red Soils From China
Journal of Environmental Quality
Management
Monitoring
Waste Management
Disposal
Technology
Policy
Water Science
Law
Environmental Engineering
Pollution
Investigation of Adsorption Behavior of Cu2O Submicro-Octahedra Towards Congo Red
Journal of Nanomaterials
Materials Science
Nanotechnology
Nanoscience
Experimental Investigation on Earing Behavior of Aluminum/Copper Bimetal Sheet
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Copper Filling Using Diallylamine Additives
Journal of The Surface Finishing Society of Japan
On Levelling Power of Copper Cyanide Plating Bath
Journal of the Metal Finishing Society of Japan
Adsorption Behavior of Copper Ion on Cellulose-Triacetate Polymer Containing .ALPHA.-hydroxyoxime Compounds.
Analytical Sciences
Analytical Chemistry
