Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Yasuhiro Fukaya
Study on Bonding of Aluminum Nitride to Metals (Report 3). Brazing of AlN to Copper Using Low Expansivity Interlayer.
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Related publications
Study on Bonding of Ruby to Metals(Report 3). Discoloration Phenomenon of Brazed Surface by Active Metal Brazing Fillers and Its Control.
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Reaction Layer and Bonding Strength at the Interface of Ruby and Ag-Cu-Ti Brazing-Filter. Study on Bonding of Ruby to Metals. (Report 1).
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Possibilities of Reduction of Growth of Intermetallic Interlayer in Steel Brazed Using Brazing Filler Metals of Copper-Phosphorus System
Автоматическая сварка
Active Metal Brazing of Machinable Aluminum Nitride-Based Ceramic to Stainless Steel
Journal of Materials Engineering and Performance
Mechanics of Materials
Materials Science
Mechanical Engineering
Thermal Conductivity of Polycrystalline Aluminum Nitride (AlN) Ceramics
Ceramica
Composites
Ceramics
AlN Interlayer to Improve the Epitaxial Growth of SmN on GaN (0001)
Journal of Crystal Growth
Inorganic Chemistry
Materials Chemistry
Condensed Matter Physics
Bonding Mechanism and Microstructure of Bonded Zone of AlN Ceramics With Ti-AgCu Brazing Metal.
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Welding, Bonding, Brazing. Part II. The Techniques for Joining of Aluminium to Dissmilar Metals by Ultrasonic Soldering.
SHINKU
Low-Temperature Bonding of Copper Pillars for All-Copper Chip-To-Substrate Interconnections
Electrochemical and Solid-State Letters
