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Publications by Yasumi Uegai
Evaluation Method of Thermal Fatigue Life for Surface-Mount Solder Joints by Mechanical Fatigue Test.
Transactions of the Japan Society of Mechanical Engineers Series A
Related publications
Evaluation of Fatigue Crack Initiation and Extension Life in Microelectronics Solder Joints of Surface Mount Type.
JSME International Journal Series A
A Method for Fatigue Life Evaluation of Solder for Electronic Equipments.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package With Underfill
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Solder Joints Reliability Prediction. Thermo-Mechanical Fatigue: The Models Based on Creep Strain. Part 2
ELECTRONICS: Science, Technology, Business
A Notch Stress Method for Fatigue Life Prediction of Spot-Welded Joints
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
Journal of Solid Mechanics and Materials Engineering
Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Observations on Fatigue Crack Growth and Fatigue Life of Riveted Lap Joints
Mechanics and Control
