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Publications by Yasushi Koito
Numerical Analysis of Printed Circuit Board With Thermal Vias: Heat Transfer Characteristics Under Nonisothermal Boundary Conditions
Journal of Electronics Cooling and Thermal Control
Related publications
Numerical Study of Conjugate Heat Transfer for Cooling the Circuit Board
Journal of Electronics Cooling and Thermal Control
Ceramic Printed Circuit Board Material.
Circuit Technology
Numerical Analysis for the Conjugate Heat Transfer of Skin Under Various Temperature Conditions of Contrast Therapy
Transactions of the Korean Society of Mechanical Engineers, B
Mechanical Engineering
Numerical Investigation of Conjugate Heat Transfer in Rectangular Micro-Channel Heat Sinks Under Laminar Flow Conditions
Academic Perspective Procedia
Numerical Analysis of the Heat Transfer Characteristics Within an Evaporating Meniscus
Numerical Investigation for Convective Heat Transfer and Friction Factor Under Pulsatile Flow Conditions
Sakarya University Journal of Science
A Printed Circuit Board Gradiometer Current Transformer
Closure to “Discussion of ‘Flow and Heat Transfer in Ducts of Arbitrary Shape With Arbitrary Thermal Boundary Conditions’” (1966, ASME J. Heat Transfer, 88, P. 358)
Journal of Heat Transfer
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Numerical Investigation of Heat Transfer Under Impinging Annular Jets
MATTER: International Journal of Science and Technology
