Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Yasuyuki Otsuka
Grain Refinement of Tough Pitch Copper by Electromagnetic Vibrations During Solidification
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
On the Ductile Fracture of Tough-Pitch Copper
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Electron Microscope Observation of Dislocation Structure in Pressurized Tough Pitch Copper
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Grain Refinement of Permanent Mold Cast Copper Base Alloys
Phase-Field Modelling of Rapid Solidification in Alloy Systems: Spontaneous Grain Refinement Effects
IOP Conference Series: Materials Science and Engineering
Materials Science
Engineering
Effect of Electromagnetic Field on the Solidification Structure of C19400 Copper Alloy
A New Solidification Method for the Grain Refinement and the Elimination of Segregation of Ingot
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
The Influence of an ECAP-based Deformation Process on the Microstructure and Properties of Electrolytic Tough Pitch Copper
Journal of Materials Science
Mechanics of Materials
Materials Science
Mechanical Engineering
Simultaneous Grain Growth and Grain Refinement in Bulk Ultrafine-Grained Copper Under Tensile Deformation at Room Temperature
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Mechanics of Materials
Alloys
Condensed Matter Physics
Metals
Competitive Grain Growth and Texture Evolution During Directional Solidification of Superalloys
