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Publications by Yoshihito Ikeda
Millimeter-Wave Flip-Chip IC Module.
Journal of SHM
Related publications
Development of Millimeter-Wave ICs Using Flip-Chip Bonding Technology
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Integrated Millimeter-Wave Antennas for On-Chip Communication
Advanced Electromagnetics
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Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
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Low Noise Titanium Nitride KIDs for SuperSpec: A Millimeter-Wave On-Chip Spectrometer
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Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.
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A Characterization Method of On-Chip Tee-Junction for Millimeter-Wave CMOS Circuit Design
Millimeter Wave Wireless Communications
Investigation of Flip-Chip Bonding for MEMS Applications
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On-Chip Technology Independent 3-D Models for Millimeter-Wave Transmission Lines With Bend and Gap Discontinuity
Progress In Electromagnetics Research B
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