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Publications by Yoshiyuki KUSHIZAKI
Termo-Viscoelastic Numerical Analysis of Residual Stress Influenced by Material Properties in Semiconductor Devices.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Numerical Study of Material Properties, Residual Stress and Crack Development in Sintered Silver Nano-Layers on Silicon Substrate
Scientia Iranica
Electronic Characteristics Changes of Semiconductor Devices Caused by Packaging Stress.
Transactions of the Japan Society of Mechanical Engineers Series A
Effect of Surface Compressive Residual Stress Introduced by Surface Treatment on Fatigue Properties of Metallic Material
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Numerical Analysis of Vertical Stress Distribution in the Direct Shear Box Devices
Strain, Stress and Semiconductor Properties
Large Strain Viscoelastic Material Model for Deformation, Stress and Strain Analysis of O-Rings
Periodica Polytechnica, Mechanical Engineering
Mechanical Engineering
Numerical Analysis of Two-Dimensional Viscoelastic Flow
Journal of the Textile Machinery Society of Japan
The Cylinder Problem in Viscoelastic Stress Analysis
Quarterly of Applied Mathematics
Applied Mathematics
Residual Stress Pattern Prediction in Spray Transfer Multipass Welding by Means of Numerical Simulation
