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Publications by Young-Ho Ko
Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Journal of Welding and Joining
Related publications
Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
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Electrical
Magnetic Materials
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Effect of 0.05 Wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint During the Thermal Aging Process
Applied Sciences (Switzerland)
Instrumentation
Materials Science
Fluid Flow
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Computer Science Applications
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Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
Journal of Solid Mechanics and Materials Engineering
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
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Condensed Matter Physics
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Microstructural Evolution of Eutectic Au-Sn Solder Joints
Creep and Creep Rupture of Sn-95Pb Solder.
Transactions of the Japan Society of Mechanical Engineers Series A
Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints
Transactions of The Japan Institute of Electronics Packaging
Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
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