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Publications by Young-eui Shin
Temperature Rise at Bonding Parts and Bonding Mechanism of Parallel Gap Bonding Method. Bonding Phenomena and Process Control on Electronic Materials With Fine Size 2nd Report.
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Related publications
Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Diffusion Bonding Process
Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Low Temperature Bonding for 3D Integration-Surface Activated Bonding (SAB)
Hyomen Kagaku
Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding
Energetics, Bonding Mechanism and Electronic Structure of Metal/Ceramic Interfaces
On the Interplay Between Charge‐Shift Bonding and Halogen Bonding
ChemPhysChem
Theoretical Chemistry
Physical
Optics
Atomic
Molecular Physics,
Bonding of Ceramics and Metal. 6. Evaluation of Bonding.
Journal of the Japan Society for Composite Materials
Bonding and Electronic Structure of XeF3-
The Mechanism of Covalent Bonding
Journal of Chemical Education
Chemistry
Education
