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Publications by Yuan LIU
Finite Element Analysis of the Stress of Premium Connection Loaded by Combined Loads
DEStech Transactions on Engineering and Technology Research
Achievement and Maintenance of Partial Nitritation by Controlling DO Concentration
Journal of Japan Society of Civil Engineers, Ser. G (Environmental Research)
Related publications
Stress Analysis of the Temporomandibular Joint by Finite Element Method.
Japanese Journal of Oral & Maxillofacial Surgery
Finite Element Analysis of Torsional Stress Wave Propagation
Journal of the Japan Society for Aeronautical and Space Sciences
Electret Microphone Modeling and Optimization by Combined Finite Element Analysis and Lumped-Element Techniques
Journal of the Acoustical Society of America
Acoustics
Ultrasonics
Arts
Humanities
Stress and Strain Propagation on Infant Skull From Impact Loads During Falls: A Finite Element Analysis
International Biomechanics
Orthopedics
Sports Medicine
Physical Therapy
Computer Science Applications
Sports Therapy
Biomedical Engineering
Rehabilitation
Finite Element Analysis for Laterally Loaded Piles in Sloping Ground
Coupled Systems Mechanics
Civil
Mechanics of Materials
Structural Engineering
Experimental Finite Element Approach for Stress Analysis
Journal of Engineering (United States)
Electronic Engineering
Industrial
Mechanical Engineering
Civil
Structural Engineering
Manufacturing Engineering
Hardware
Electrical
Chemical Engineering
Architecture
Microscopic Stress Analysis of Heterogeneous Media by Finite Element Mesh Superposition Method.
Transactions of the Japan Society of Mechanical Engineers Series A
Influence of Gait Cycle Loads on Stress Distribution at the Residual Limb/Socket Interface of Transfemoral Amputees: A Finite Element Analysis
Scientific Reports
Multidisciplinary
A Finite Element Analysis of Process-Induced Stress in Scaled-Down MOSFETs. Finite Element Stress Analysis and Evaluation of Its Validity by Using Convergent-Beam Electron Diffraction.
Transactions of the Japan Society of Mechanical Engineers Series A
