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Publications by Yuji Shiratori
Growth Kinetics of Reaction Layers in Flip Chip Joints With Cu-Cored Lead-Free Solder Balls
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
International Symposium on Microelectronics
Interface Reaction and Mechanical Properties of Lead-Free Sn-Zn Alloy/Cu Joints
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Solder Paste Reflow Modeling for Flip Chip Assembly
Effect of Void Propagation on Bump Resistance Due to Electromigration in Flip-Chip Solder Joints Using Kelvin Structure
Applied Physics Letters
Astronomy
Physics
Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package With Underfill
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Lead-Free Solder Paste and VOC-Free Solder Paste.
Journal of SHM