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Publications by Yukihiro Kanechika
Technology Trend of High Heat Dissipation AlN Substrate for Semiconductor Device
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
CMP Technology for Interconnect of Semiconductor Device
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Co-Fired AlN–TiN Assembly as a New Substrate Technology for High-Temperature Power Electronics Packaging
Ceramics International
Surfaces
Optical
Materials Chemistry
Process Chemistry
Technology
Magnetic Materials
Films
Composites
Electronic
Coatings
Ceramics
Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate
Journal of Heat Transfer
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Forced Air-Cooling for CPU Modules With High Heat Dissipation.
Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Condensed Matter Physics
Mechanical Engineering
A Modular High Temperature Measurement Set-Up for Semiconductor Device Characterization
Introduction of the Latest Activity of Device Embedded Substrate Technology Committee
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Semiconductor Device Concepts
Research and Application of Thermoelectric Energy Conversion Device Based on Heat Dissipation of Coal Pile
Energy and Environment Research
Erratum For: An On-Wafer Embedded Passive Device Using Chip-In-Substrate Packaging Technology
Microwave and Optical Technology Letters
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Optical
Electrical
Atomic
Magnetic Materials
Optics
