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Publications by Yukiko NISHIOKA
Copper Surface Analyses After Cu CMP Processing
Electrochemistry
Electrochemistry
Related publications
Copper CMP Mimicked With Atomic Force Microscopy
Real Time Monitor of Cu Pollution in Clean Room Ambient Near Cu CMP Equipment
Mechanical Removal in CMP of Copper Using Alumina Abrasives
Journal of the Electrochemical Society
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Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Immobilized Cu Adatoms: Amino Acid Immobilization of Copper Surface Diffusion on Cu(111) (Adv. Mater. Interfaces 7/2019)
Advanced Materials Interfaces
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Surface Ruggedness Processing of Cylindrical Cu-Zn Wire With Wet Blasting
Window-Controlled CMP Crosscorrelation Analysis for Surface Waves in Laterally Heterogeneous Media
Geophysics
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The Ag−Cu (Silver-Copper) System
Bulletin of Alloy Phase Diagrams
Al-Au-Cu (Aluminum-Gold-Copper)
Journal of Phase Equilibria and Diffusion
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Tetra-Μ-Benzoato-Bis[(3-Methylquinoline)copper(II)](Cu—Cu)
Acta Crystallographica Section E Structure Reports Online
