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Publications by Yun-San ZHANG
Electrodeposition of Copper From Ethylenediamine Complex Solution and Properties of Deposit.
Journal of the Surface Finishing Society of Japan
Related publications
Electrodeposition of Copper From Ethylenediamine Complex Bath for ULSI Metallization.
Journal of the Surface Finishing Society of Japan
Electrodeposition of Copper From the Bath of Aminoacid Complex Salts
Journal of the Metal Finishing Society of Japan
Electrodeposition of Metals From Non-Aqueous Solution.
Jitsumu Hyomen Gijutsu
Unique Solution Properties of Quaternized Oligomeric Surfactants Derived From Ethylenediamine or G0 Poly (Amidoamine) Dendrimers
Journal of Oleo Science
Medicine
Chemistry
Chemical Engineering
Investigation of Copper Recovery From a New Copper Deposit (Nussir) in Northern Norway
Mineral Processing and Extractive Metallurgy Review
Geotechnical Engineering
Chemistry
Engineering Geology
Mechanical Engineering
Economic Geology
The Crystal and Molecular Structures ofN,N′-di(2-acetylcyclohexenyl)ethylenediamine and Its Copper(II) Complex
Canadian Journal of Chemistry
Organic Chemistry
Catalysis
Chemistry
Electrodeposition of Copper and Silver From Wastewater at Flow-Through Porous Electrodes
Environmental Engineering and Management Journal
Management
Monitoring
Policy
Law
Environmental Engineering
Pollution
Electrodeposition Behavior of Zn-Fe Alloy From Zincate Solution Containing Triethanolamine
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Electrodeposition Behavior of Zn-Polyethyleneimine Composite From Sulfate Solution and Its Micro Structure
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals