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Publications by Yutaka OKINAKA
An Electrochemical Investigation of Additive Effect in Trench-Filling of ULSI Interconnects by Electroless Copper Deposition
Electrochemistry
Electrochemistry
Characteristics of Anodic Curret-Time Curves of Copper in Orthophosphoric Acid Media
Journal of the Metal Finishing Society of Japan
Related publications
Film Properties of Full-Additive Electroless Copper Deposits and Their Electrochemical Mixed Potential Monitoring
Circuit Technology
Electrochemical Na-Insertion/Extraction Property of Ni-Coated Black Phosphorus Prepared by an Electroless Deposition Method
ACS Omega
Chemistry
Chemical Engineering
Effects of Additives and Dissolved Oxygen on Electroless Copper Deposition.
Journal of the Metal Finishing Society of Japan
Copper Interconnects Grown by Electrochemical Displacing the Prepatterned SiC Barrier Thin Film
Electrochemical and Solid-State Letters
Electrochemical Deposition of Copper(I) Oxide Films
Chemistry of Materials
Materials Chemistry
Chemistry
Chemical Engineering
Optimization of a Pretreatment for Copper Electroless Deposition on Ta Substrates
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Additive Fine-Line Circuit Process Through Catalyst Induced Copper Electroless Plating
Journal of Mechanics Engineering and Automation
Electrochemical Behaviour of Arsenic on Copper Deposition Reaction in the Low Copper Concentration Electrolyte
Asian Journal of Chemistry
Chemistry
An Investigation of Aganoerion Polymorphum Leaf Extract as a Copper Working Fluids’ Additive
Vietnam Journal of Science and Technology
