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Publications by Yuuki KAMIURA

Mass Balance and Deposition Mechanism of Electroless Palladium Plating Using Trimethylamine Borane as a Reducing Agent.

Journal of the Surface Finishing Society of Japan
1996English

Related publications

Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating From a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent.

Journal of the Surface Finishing Society of Japan
1993English

Amorphous Like Ni-B Alloy Prepared by Electroless Plating Method Using Dimethylamine Borane as Reducing Agent

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
1981English

Electroless Plating of Cobalt Containing Tungsten Using Hydrazine as a Reducing Agent

Journal of The Surface Finishing Society of Japan
2004English

Development of Low-Temperature Type Electroless Nickel Plating Bath Containing Hypophosphite as a Reducing Agent.

Journal of the Surface Finishing Society of Japan
1991English

Coulostatic Monitoring the Deposition Rate of Electroless Nickel Plating.

Journal of the Surface Finishing Society of Japan
1990English

Electroless Plating

Journal of the Japan Society of Colour Material
1996English

Electroless Copper Plating Onto Polyimide Using Polymer Nanosheet as a Nano-Adhesive

Polymer Journal
PolymersMaterials ChemistryPlastics
2006English

Electroless Plating of Paper

Sen'i Gakkaishi
Materials ScienceIndustrialPolymersManufacturing EngineeringPlasticsChemical Engineering
1986English

New Electroless Plating Using Nano Dispersion of Polypyrrole

Journal of The Surface Finishing Society of Japan
2011English

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