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Publications by Zhidong Xia
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Related publications
Transition Behaviour and Evaluation of Fracture Toughness in Charpy Impact Test
Transactions of the Iron and Steel Institute of Japan
Pb-Free High Temperature Solder Joints for Power Semiconductor Devices
Transactions of The Japan Institute of Electronics Packaging
The Review of Mounting Technology With Pb-Free Solder.
Journal of SHM
Development of Pb-Free Solder Distributed Conductive Plastics.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Coupled Microstructural and Calorimetric Investigation of Controlled Solder Joint Microstructures in Pb-Free Solder
Microscopy and Microanalysis
Instrumentation
Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish
An Experimental Study of the Effect of Thermal Treatments & Charpy Impact Test Parameters on Impact Toughness of EN31 Steel
IOSR Journal of Mechanical and Civil Engineering
Effective Grain Size and Charpy Impact Properties of High-Toughness X70 Pipeline Steels
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Mechanics of Materials
Alloys
Condensed Matter Physics
Metals
Fracture Characteristics of Some Aluminum Alloy Sheets in Charpy Impact Test at Super-Low Temperatures
Keikinzoku/Journal of Japan Institute of Light Metals
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
