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Publications by Zhong-Liang Pan
Thermal Model for Three-Dimensional Integrated Circuits With Integrated MLGNR-based TSV
Thermal Science
Renewable Energy
the Environment
Sustainability
Related publications
Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Dynamic Electrothermal Simulation of Three-Dimensional Integrated Circuits Using Standard Cell Macromodels
IET Circuits, Devices and Systems
Control
Systems Engineering
Electrical
Electronic Engineering
Reconfigured Test Architecture Optimization for TSV-based Three-Dimensional SoCs
IEICE Electronics Express
Electronic Engineering
Condensed Matter Physics
Optical
Electrical
Magnetic Materials
Electronic
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Modeling of 3-Dimensional Defects in Integrated Circuits
Thermal Transient Mapping Systems for Integrated Semiconductor Devices and Circuits
Photonic Integrated Circuits
Photonics Russia
Diamond-Integrated Optomechanical Circuits
Nature Communications
Astronomy
Genetics
Molecular Biology
Biochemistry
Chemistry
Physics
Computer-Aided Design for Integrated Circuits
Microelectronics Reliability
Surfaces
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Films
Optical
Electrical
Atomic
Magnetic Materials
Nanotechnology
Reliability
Safety
Coatings
Optics
Quality
Risk
