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Publications in Electrical
Second Law Analysis for Couple Stress Fluid Flow Through a Porous Medium With Constant Heat Flux
Entropy
Electronic Engineering
Information Systems
Mathematical Physics
Electrical
Astronomy
Physics
Manufacturing Signatures of Injection Molding and Injection Compression Molding for Micro-Structured Polymer Fresnel Lens Production
Micromachines
Control
Systems Engineering
Electrical
Mechanical Engineering
Electronic Engineering
Preparation of an Acridinium Ester-Labeled Antibody and Its Application in GoldMag Nanoparticle-Based, Ultrasensitive Chemiluminescence Immunoassay for the Detection of Human Epididymis Protein 4
Micromachines
Control
Systems Engineering
Electrical
Mechanical Engineering
Electronic Engineering
Lifetime Reliability-Aware Digital Synthesis
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Hardware
Electronic Engineering
Electrical
Architecture
Software
Numerical Study of Entropy Generation Within Thermoacoustic Heat Exchangers With Plane Fins
Entropy
Electronic Engineering
Information Systems
Mathematical Physics
Electrical
Astronomy
Physics
Undoped and Nd3+doped Si-Based Single Layers and Superlattices for Photonic Applications
Physica Status Solidi (A) Applications and Materials Science
Surfaces
Electronic Engineering
Condensed Matter Physics
Materials Chemistry
Optical
Electrical
Magnetic Materials
Films
Coatings
Electronic
Interfaces
Hole Injection Contribution to Transport Mechanisms in Metal/P−/P++ and Metal/Oxide/P−/P++ Diamond Structures
Physica Status Solidi (A) Applications and Materials Science
Surfaces
Electronic Engineering
Condensed Matter Physics
Materials Chemistry
Optical
Electrical
Magnetic Materials
Films
Coatings
Electronic
Interfaces
A Research Agenda Acknowledging the Persistence of Passwords
IEEE Security and Privacy
Computer Networks
Electronic Engineering
Law
Electrical
Communications
Thermoplastic Micromodel Investigation of Two-Phase Flows in a Fractured Porous Medium
Micromachines
Control
Systems Engineering
Electrical
Mechanical Engineering
Electronic Engineering
Rheological Issues in Carbon-Based Inks for Additive Manufacturing
Micromachines
Control
Systems Engineering
Electrical
Mechanical Engineering
Electronic Engineering
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