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Stress Measurement by Copper Electroplating Aided by Image Processing Technique. Measurement Based on the Grain Growth Rate.

Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
1989English

Topological Order Generated by a Random Field in a 2D Exchange Model

Physical Review Letters
AstronomyPhysics
2018English

Non-Thermal Influence of a Weak Microwave on Nerve Fiber Activity

Journal of Physical Chemistry & Biophysics
2014English

Logical Error Rate in the Pauli Twirling Approximation

Scientific Reports
Multidisciplinary
2015English

The Relation Between GxE Interaction and the Number of Locations in Series of Oilseed Rape Trials

Biometrical Letters
2013English

The Roles of the Terms of Trade and Nontraded-Good-Prices in Exchange Rate Variations

1984English

Male Sterility Caused by Cooling Treatment at the Young Microspore Stage in Rice Plants : X. A Secondary Sensitive Stage at the Beginning of Meiosis

Japanese Journal of Crop Science
GeneticsAgronomyCrop ScienceFood Science
1974English

The Asian Business Sector and the Dynamics of Change

Equal Opportunities International
2008English

Probing the Tunnelling Site of Electrons in Strong Field Enhanced Ionization of Molecules

Nature Communications
AstronomyGeneticsMolecular BiologyBiochemistryChemistryPhysics
2012English

Point Defects Observed in D-T Neutron Irradiated Copper, Silver and Gold at 288 K With a Rotating Target in FNS_JAERI

Materials Research Society Symposium - Proceedings
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2000English

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