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Solderjet Bumping Technique Used to Manufacture a Compact and Robust Green Solid-State Laser
doi 10.1117/12.2178373
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Date
June 1, 2015
Authors
P. Ribes
T. Burkhardt
M. Hornaff
S. Kousar
D. Burkhardt
E. Beckert
M. Gilaberte
D. Guilhot
D. Montes
M. Galan
S. Ferrando
M. Laudisio
T. Belenguer
S. Ibarmia
P. Gallego
J. A. Rodríguez
R. Eberhardt
A. Tünnermann
Publisher
SPIE
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