Stability and Formation Kinetics of TiN and Silicides in the Ti/Si3N4 Diffusion Couple

Le Journal de Physique IV
doi 10.1051/jp4:19937167
Full Text
Abstract

Available in full text

Date
Authors
Publisher

EDP Sciences

Related search

Formation Mechanism of Diffusion-Reaction Layer for a Cu/Ti Diffusion Couple Under Different Heating Methods

Materiali in Tehnologije
PolymersAlloysPlasticsMetals
2017English

Silicides and Nitrides Formation in Ti Films Coated on Si and Exposed to (Ar-N2-H2) Expanding Plasma

Coatings
SurfacesFilmsCoatingsMaterials ChemistryInterfaces
2017English

SiC and Ferro-Silicides Formation in Tuyere Cokes

ISIJ International
Mechanics of MaterialsAlloysMaterials ChemistryMetalsMechanical Engineering
2013English

Diffusion Coefficient of Copper, Tin and Copper Tin Alloy

EPJ Web of Conferences
AstronomyPhysics
2011English

Fracture Resistance and Contact Damage of TiN Particle Reinforced Si3N4 Ceramics

Journal of the Ceramic Society of Japan
Materials ChemistryChemistryCondensed Matter PhysicsCompositesCeramics
2006English

Kinetics of the Sigma-Phase Formation in an (Fe53.8 Cr46.2)-0.1at.% Ti Alloy

Philosophical Magazine Letters
Condensed Matter Physics
1999English

Common Law Marriage and Couple Formation

IZA Journal of Labor Economics
Industrial RelationsEconomicsEconometricsHuman Resource ManagementOrganizational Behavior
2014English

Synthesis and Characterization of TiN / Ti / AISI 410 Coatings

Journal of Sciences and Engineering
2018English

Effect of Ambient Temperature on the Formation and Stability of Nanocrystalline Structures in the Ti-Cu System.

Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
AlloysIndustrialMechanical EngineeringMetalsMaterials ChemistryManufacturing Engineering
1993English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy