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Fatigue Crack Propagation Along Polymer-Metal Interfaces in Microelectronic Packages
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
doi 10.1109/95.650940
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Date
January 1, 1997
Authors
J. Guzek
H. Azimi
S. Suresh
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
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