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A Release Property of High-Permittivity Thin Film Manufactured With Nano-Transfer Method
Transactions of The Japan Institute of Electronics Packaging
doi 10.5104/jiepeng.4.36
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Date
January 1, 2011
Authors
K. Iimura
T. Hosono
M. Ichiki
T. Itoh
T. Suga
Publisher
Japan Institute of Electronics Packaging
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