A Proposal for Strain Measurement in Electronic Packages Using Phase-Shifted Sampling Moiré Method

Journal of Japan Institute of Electronics Packaging - Japan
doi 10.5104/jiep.22.95
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Strain Measurement in Micro-Electronic Packages Using the Digital Image Correlation Method

Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of MaterialsSurfacesAlloysMechanical EngineeringMetalsFilmsCoatings
2010English

Thermal Cycling Simulation in Electronic Packages Using Molecular Dynamic Method

English

A Phase Shifting Shadow MoirÉ Method Using Two Frame Images of Varying Light

2019English

Improved Phase-Shifting Method for Automatic Processing of Moiré Deflectograms

Applied Optics
1998English

A Method for the Direct Measurement of Electronic Site Populations in a Molecular Aggregate Using Two-Dimensional Electronic-Vibrational Spectroscopy

Journal of Chemical Physics
MedicineTheoretical ChemistryAstronomyPhysicsPhysical
2015English

Stereo Moiré Technique: A Novel 3-D Measurement Method Using a Stereo Camera and a Digital Pattern Projector

International Journal of Optomechatronics
Electronic EngineeringElectricalMechanical EngineeringInstrumentation
2007English

A Simple Measurement Method of Dynamic Yield Strength Using Strain Data.

Transactions of the Japan Society of Mechanical Engineers Series A
1995English

Proposal of a Simple Method for Evaluating Elasto-Plastic Strain in Interface-Notched Plates

Journal of Japan Society of Civil Engineers, Ser. A2 (Applied Mechanics (AM))
2013English

A Proposal of Optimal Sampling Design Using a Modularity Strategy

Water Resources Research
Water ScienceTechnology
2016English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy