Growth Kinetics of Intermetallic Compounds on the Boundary Between Au and In-48Sn Solder.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
doi 10.5104/jiep1995.13.24
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Correlation Between Grain Boundary Structure and Grain Boundary Strength in Intermetallic Compounds;.

Bulletin of the Japan Institute of Metals
1992English

Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases

Materials Transactions
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2005English

Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish

English

Growth Kinetics of Antiphase Domain in Ti3Al Intermetallic Compound

Science and Technology of Advanced Materials
Materials Science
2004English

Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

MATEC Web of Conferences
Materials ScienceEngineeringChemistry
2016English

Intermetallic Compounds

English

Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth During Thermal Aging of SAC305 Solder Alloy

Journal of Material Science & Engineering
2013English

Diffusion in Intermetallic Compounds.

Bulletin of the Japan Institute of Metals
1989English

Intermetallic Compounds

English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy