Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

MATEC Web of Conferences- France

doi 10.1051/matecconf/20167801064

Full Text

Abstract

Available in

Date

January 1, 2016

Authors

Publisher

EDP Sciences

Related search

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging

Scientific Reports

Multidisciplinary

2019

English

Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Alloys

Materials Chemistry

Condensed Matter Physics

Metals

2006

English

Growth Kinetics of Cu6Sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Temperature Gradient

Scientific Reports

Multidisciplinary

2015

English

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints

Scientific Reports

Multidisciplinary

2019

English

Effect of Bi or Sb Addition on High Temperature Deformation Behavior in Sn-Cu-Ni Solder Alloys

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Alloys

Materials Chemistry

Condensed Matter Physics

Metals

2017

English

Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases

Materials Transactions

Mechanics of Materials

Materials Science

Condensed Matter Physics

Mechanical Engineering

2005

English

Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes

Journal of Applied Physics

Astronomy

Physics

2006

English

Metal Particles Size Influence on Graded Structure in Composite Al2O3-Ni

Materiali in Tehnologije

English

Precipitation in a Cu-20%Ni-8%Sn Alloy and the Phase Diagram of the Cu-Ni Rich Cu-Ni-Sn System

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Alloys

Materials Chemistry

Condensed Matter Physics

Metals

1983

English

Amanote Research

Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

MATEC Web of Conferences- France

Full Text

Abstract

Categories

Date

Authors

Publisher

Related search

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging

Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate

Growth Kinetics of Cu6Sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Temperature Gradient

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints

Effect of Bi or Sb Addition on High Temperature Deformation Behavior in Sn-Cu-Ni Solder Alloys

Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases

Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes

Metal Particles Size Influence on Graded Structure in Composite Al2O3-Ni

Precipitation in a Cu-20%Ni-8%Sn Alloy and the Phase Diagram of the Cu-Ni Rich Cu-Ni-Sn System

Amanote Research

Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

MATEC Web of Conferences- France

Full Text

Abstract

Categories

Date

Authors

Publisher

Related search

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging

Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate

Growth Kinetics of Cu6Sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Temperature Gradient

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints

Effect of Bi or Sb Addition on High Temperature Deformation Behavior in Sn-Cu-Ni Solder Alloys

Reactivity Between Sn&ndash;Ag Solder and Au/Ni&ndash;Co Plating to Form Intermetallic Phases

Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes

Metal Particles Size Influence on Graded Structure in Composite Al2O3-Ni

Precipitation in a Cu-20%Ni-8%Sn Alloy and the Phase Diagram of the Cu-Ni Rich Cu-Ni-Sn System

Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases